參數(shù)名稱 | 參數(shù)值 |
---|---|
Product Status | Active |
Type | PGA |
Number of Positions or Pins (Grid) | 168 (17 x 17) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30.0μin (0.76μm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Carrier, Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin-Lead |
Contact Finish Thickness - Post | 200.0μin (5.08μm) |
Contact Material - Post | - |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature | - |
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